Cost a Major Challenge for Advanced Packaging Solutions

To many in the semiconductor industry, the importance of packaging, assembly and test is becoming increasingly obvious. Over the past several years, IDMs have seen the price of silicon fabrication fall, while the cost of packaging, assembly and test has steadily been on the rise. As much attention as is paid to cost savings realized through improvements in front-end manufacturing, today there is likely just as much to be gained in looking for improvements in final manufacturing. More info ...