New Packaging Dimensions, Frontiers

No longer confined to the "back end" of manufacturing, packaging technologies are very much at the fore of industry thinking as industry technologists look to address the challenges of increasingly complex devices. ICs at 22 nm design rules, 3-D designs, MEMS devices, and emerging technologies such as biomedical applications are among the key drivers shaping advanced packaging technologies, and are part of the technology showcase at SEMICON West 2009. More info...